Case Foam Collection
Specs
- Material: PORON
DZ64 RGB CASE FOAM
- Thickness: 2mm
Case | Compatible |
TOFU Aluminum and acrylic case | YES |
5° Aluminum and acrylic case | YES |
GH60 HiProfile | YES |
GH60 LowProfile | YES |
Plastic Case | NO |
Wood Case | NO |
Bamboo case | NO |
DZ60RGB-WKL CASE FOAM
- Compatible with DZ60RGB-WKL PCB
- Thickness: 2mm
DZ65RGB CASE FOAM
- Compatible with TOFU65 aluminum case and TADA68 aluminum case, not compatible with TadA68 plastic Case, Thanks
- Thickness: 2mm
KBD67V2 CASE FOAM
- Compatible with TOFU65 aluminum case and TADA68 aluminum case, not compatible with TadA68 plastic Case, Thanks
- Thickness: 2mm
DZ60 RGB CASE FOAM
- Thickness: 2mm
Case | Compatible |
TOFU Aluminum and acrylic case | YES |
5° Aluminum and acrylic case | YES |
GH60 HiProfile | YES |
GH60 LowProfile | YES |
Plastic Case | NO |
Wood Case | NO |
Bamboo case | NO |
KBD8X MARK II CASE FOAM
- Compatible with KBD8x MarK II only
- Thickness: 3 mm
- Black color
KBD75 CASE FOAM (HOT-SWAP VERSION)
- For KBD75 hot-swap PCB only
- Only compatible with KBD75 v3/ v3.1, D84 case
- Thickness: 2mm
- Put it between the PCB and Case
KBD75 CASE FOAM (SOLDER VERISON)
- For KBD75 v2 soldered PCB
- Compatible with KBD75 V1, KBD75 V2, KBD75 V3, Tofu84, D84 Keyboard
- Thickness: 2mm
KBD67 MARK II CASE FOAM (HOT-SWAP/SOLDERED VERSION)
- Compatible with KBD67 MarK II and D65 cases
- Thickness: 2mm
DZ60RGB-ANSI CASE FOAM
- Thickness: 2mm
Case | Compatible |
TOFU Aluminum and acrylic case | YES |
5° Aluminum and acrylic case | YES |
GH60 HiProfile | YES |
GH60 LowProfile | YES |
Plastic Case | NO |
Wood Case | NO |
Bamboo case | NO |
DZ60 SOLDERED CASE FOAM
- Only a case foam included, no other parts
Case | Compatible |
TOFU Aluminum and acrylic case | YES |
5° Aluminum and acrylic case | YES |
GH60 HighProfile | YES |
GH60 LowProfile | YES |
Plastic Case | NO |
Wood Case | NO |
Bamboo case | NO |